TopSec fingerprint recognition module B.4
with NEXT Biometrics active thermal fingerprint area sensor
The NEXT Biometrics One Touch 100 Module supports a large sensor area based on NEXT Active Thermal technology. The sensor operates reliable in difficult environments e.g. high humidity, wet or fat fingers or dirt.
Because of its thin form factor the One Touch Access Modules can be easily mounted in terminals or other devices.
TopSec fingerprint recognition module B.4
with NEXT Biometrics active thermal fingerprint area sensor
The NEXT Biometrics One Touch 100 Module supports a large sensor area based on NEXT Active Thermal technology. The sensor operates reliable in difficult environments e.g. high humidity, wet or fat fingers or dirt.
Because of its thin form factor the One Touch Access Modules can be easily mounted in terminals or other devices.
Contact us quick and directly with phone, email - We provide overall support and answer all your questions.
With our partners we provide a strong network with Know How and experience.
With that network we are able to react and act on the broad spectrum of fingerprint recognition technology for various customer requirements.
Contact us quick and directly with phone, email - We provide overall support and answer all your questions.
With our partners we provide a strong network with Know How and experience.
With that network we are able to react and act on the broad spectrum of fingerprint recognition technology for various customer requirements.
Contact us quick and directly with phone, email - We provide overall support and answer all your questions.
With our partners we provide a strong network with Know How and experience.
With that network we are able to react and act on the broad spectrum of fingerprint recognition technology for various customer requirements.
Overview of NextBiometrics Sensors
The TopSec B.4 fingerprint module supports NextBiometrics S-2023 fingerprint sensors and following HW versions with different FW versions.
NB-2023-S One touch Access 100 Module
- Next Active Thermal scanning
- 11.9 mm x 16.9 mm active sensor area
- 180 x 256 Pixel, 385 dpi, 256 grey levels
- operation: -20 to + 60 degree C, > 2 Mio TIPS
Supported Communication Interfaces
for TopSec ID B.x fingerprint recognition modules
Supported Communication Interfaces
for TopSec ID B.x fingerprint recognition modules
Supported Communication Interfaces
for TopSec ID B.x fingerprint recognition modules
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